Headline: Nvidia Looks to Accelerate Production With New Packaging Tech
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Yahoo Finance reports that Nvidia Corp has announced plans to use Fan-Out Panel Level Packaging (FOPLP) technology to package its GB200 AI server chips. The change was reportedly made to address production constraints on the currently used Chip on Wafer Substrate (CoWoS) packaging
Keywords: Nvidia,looks,accelerate,production,new,packaging,tech,Fan-Out Panel level pakcaging,FOPLLP,technology,GB200,AI,server,chips,Artificial,Intelligence,expand,capacity
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